基本信息: 王传蔚，研究员，博士 动力机械工程专业 个人教育与工作简历： 2003.09–2008.02 清华大学动力机械，博士毕业 2007.05–2011.09 原相科技 2011.11–2012.05 Miradia Inc. 2012.05–2012.10 Gertek Inc. 2013.07–2016.08 晶镁电子 2017.01–至今 QUATEK ELECTRONICS LTD. 研究方向： 微机电传感器 模拟感测前端电路及控制工程算法 代表性论文： A. Journal Papers: 实际透过DSP使用锁相回控制用于微机电扫描镜面 1.Chuanwei Wang, H. Yu, M.Wu, and Weileun Fang,“Implementation of Phase-Locked Loop Control for MEMS Scanning Mirror Using DSP,”Sensors & Actuators: A. Physical, 2006. 出平面全差动间隙电容感测加速计 2.Chuanwei Wang, Ming-Han Tsai, Chih-Ming Sun, and Weileun Fang, A novel CMOS out-of-plane accelerometer with fully differential gap-closing capacitance sensing electrodes,” J. Micromech. Microeng, pp. 1275-1280, 2007. 改善CMOS 电容加速计灵敏度 3.Chih-Ming Sun, Chuanwei Wang, Weileun Fang,“On the sensitivity improvement of CMOS capacitive accelerometer,” Sensors & Actuators: A. Physical, 2007. 后制程金属蚀刻的设计与应用用于CMOS MEMS电容传感器 4.Ming-Han Tsai, Chih-Ming Sun, Yu-Chia Liu, Chuanwei Wang, and Weileun Fang,“Design and application of a metal wet-etching post process for the improvement of CMOS MEMS capacitive sensors,” J. Micromech Microeng, 2009. B. Conference Papers: 使用锁相回路来控制微机电共振组件 1.C. Wang, H. Y. U, C. Tsou , and W. Fang,“Application of Phase-Locked Loop Control for MEMS Resonant Device,”IEEE Optical MEMS 2005, Oulu, Finland. 全新四个感测电极之CMOS MEMS 加速计 2.C. Sun, C. Wang, D. Liu, Michael S. Lu, W. Fang, C. Liang, H. Hsieh, H. Chang, and T. Shing, “A Novel CMOS MEMS Accelerometer with Four Sensing Finger Arrays, ” IEEE sensor 2006, Korea. CMOS MEMS 劳伦知力双轴扫描平台 3.C. Sun, C. Wang, W. Fang, “CMOS MEMS Lorentz Force Dual-axis Scanning-Stage,”the 2nd Annual IEEE NEMS 2007, Bangkok, Thailand. 全新出平面加速计与全差动感测电路 4.M.-H Tsai, C. Wang, C.-M Sun and W. Fang, 2007,“A Novel CMOS Out-of-plane Accelerometer with Fully-differential Sensing Circuit and Sub-micron Gap,” Transducers 07, Layne, French, pp.1487-1490. 单体化传感器整合应用于CMOS MEMS双面后制程 5.C.-M. Sun, C. Wang, M.-H. Tsai, and W. Fang,“A Novel Double-side CMOS-MEMS Post Processing for Monolithic Sensor Integration,”IEEE MEMS 2008, Tucson,USA. 专利： 01. Micromachined structures, No.9,070,699 02. Method for fabricating variable parallel plate capacitors, No. 8,105,498 03. Out-of-plane sensing device, No.7,849,742 04. MEMS acoustic pressure sensor device and method for making same, No.10,081,538 05. Complementary metal-oxide-semiconductor (CMOS) micro electro-mechanical (MEMS) microphone and method for fabricating the same, No. 11,008,215 06. Time of flight system capable of increasing measurement accuracy, saving power and/or increasing motion detection rate and method thereof, No. 9,618,610 07. Microphone device for reducing noise coupling effect, No. 9,491,531 08. Microphone structure, No. 9,258,652 09. MEMS microphone device and method for making same, No. 9,150,403 10. MEMS package structure, No. 9,000,544 11. 3D information generator for use in interactive interface and method for 3D information generation, No.8,836,761 12. MEMS structure preventing stiction, No. 8,952,463 13. Sensor manufacturing method, No. 8,828,771 14. MEMS integrated chip with cross-area interconnection, No. 8,729,660 15. MEMS sensing device and method for the same, No. 8,772,885 16. Optical detection method and optical MEMS detector, and method for making MEMS detector, No. 8,368,005 17. Micro electronic device having CMOS circuit and MEMS resonator formed on common silicon substrate, No. 8,692,338 18. Microelectronic device and MEMS package structure and fabricating method thereof, No. 8,679,886 19. Micro-electro-mechanical system device, out-of-plane sensor and method for making micro-electro-mechanical system device, No. 8,640,543 20. MEMS sensing device and method for making same, No. 8,519,491 21. MEMS integrated chip and method for making same, No. 8,513,041 22. MEMS device and deformation protection structure therefor and method for making same, No. 8,479,576 23. MEMS accelerometer with enhanced structural strength, No. 8,459,115 24. Micro-electro-mechanical system device and method for making same, No. 8,426,934 25. Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same, No. 8,424,383 26. In-plane sensor,out-of-plane sensor, and method for making same, No. 8,371,167 27. MEMS device and MEMS spring element, No. 8,183,650 28. Micro-electro-mechanical-system device with particles blocking function and method for making same, No.7,897,506 29. Package method of micro-electro-mechanical system chip, No. 7,989,246 30. Micromachined sensors,No. 7,814,794 31. Method for fabricating micromachined structures, No. 7,785,481 32. Micro-electro-mechanical system device and method for making same, No.7,759,256 33. Accelerometer, No.7,412,888 |
